Printoganth FF – The Formaldehyde Free Electroless Copper Process - Sponsored Whitepaper

The most commonly known and used metallization technique in PCB manufacturing – electroless copper – will have to meet modern ecological requirements. The main concern is the use of toxic formaldehyde as reducing agent. The Printoganth FF process uses the much more friendly alternative hypophosphite for the reduction of copper ions.

Even though many theoretical and applied investigations have already been published, the final realization for a process that is suitable for continuous mass production has turned out to be difficult. Besides finding the optimum process conditions, the determination of the metallization mechanism is most critical. One of the key factors for a suitable process is the control of deposition speed and deposit structure, which requires the correct formulation of the stabilising system.

2. General Process Upcoming demands on the PCB industry to implement environmentally friendly processes with the same quality as currently used proven systems, requires a short term realization. Even so meeting the demands of high density technologies, such as fine line developments requires a non conducting dielectric surface to avoid electrical failures like high resistance shorts. Alkaline ionic palladium activation has proven to give a fine homogenous palladium layer for superb electroless copper adhesion whilst after the copper removal by etching there is no or negligible conductivity due to palladium particles on the surface.