Flexible PCB Plating Through Hole Considerations, Experiences - Sponsored Whitepaper

Due to the worldwide increase in demand for flex and flex-rigid panels as well as the shift in the required designs of panels there is an extreme need for improved PTH processing. There are several proven routes for high technology flex / flex-rigid manufacturing as well as for high volume applications, but lately there have been some developments. From this presentation, along with suitable examples, we aim to give an insight into the current status of flex / flex-rigid manufacturing, from the point of view of PTH processing, as well as suitable solutions to common manufacturing issues.

Introduction At the moment there is a strong increase in the desire for flex and flex-rigid PCBs (FPCs) due to certain market sectors. The increased technological demands from the latest handheld devices containing cameras and new high resolution screens as well as the newer mobile phones means that there is a surge in the requirement for flex-rigid panels and multi-flex panels. The need to mass produce these panel types and to reduce the cost of manufacture, as always has driven the development of newer methods of processing.

Technically the materials involved in flex / flex-rigid board manufacturing generate a large number of issues. One key concern is the large variance of materials in one board build-up as well as the exotic nature of some of the commonly used materials and the inherent issues they raise. We will discuss some of the differences in common materials used as well as common board build-ups and relate this to processing issues. We will provide examples for several common flex / flex-rigid board constructions and will show some of the processing answers to the various issues raised. Lastly we will integrate new developments in processing whilst explaining the benefits each one brings.