New Plating Technology for Blind Micro Via Filling - Sponsored Whitepaper

Blind micro via filling technology is used in the chip carrier and packaging industry particularly for the production of stacked vias, as an example 3 or more filled blind micro vias can be produced on top of each other. The advantages of this technology particularly in enabling a greater degree of miniaturisation are now being used for hand held devices for example giving the possibility for direct bonding to the filled via in pad. Explore the limiting factors in the acid copper electrolyte lifetime currently in production for blind micro via filling and how this can be overcome in a system using insoluble anodes.